Methods of manufacturing multi-band surface acoustic wave filters
AssigneeSkyworks Solutions, Inc.
InventorsTakanori Yasuda, Ousmane I Barry, Keiichi Maki, Hiroyuki Nakamura
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AssigneeSkyworks Solutions, Inc.
InventorsTakanori Yasuda, Ousmane I Barry, Keiichi Maki, Hiroyuki Nakamura
Estimating the term…
A method of manufacturing a packaged surface acoustic wave filter chip is disclosed. The method can include providing a structure having first interdigital transducer electrodes formed with a first piezoelectric layer, second interdigital transducer electrodes formed with a second piezoelectric layer, and a substrate between the first and second piezoelectric layers. The method can include forming a plurality of through electrodes extending at least partially through a thickness of the structure such that a first set of through electrodes of the plurality of through electrodes are electrically connected to the first interdigital transducer electrodes and a second set of through electrodes of the plurality of through electrodes are electrically isolated from the first interdigital transducer electrodes.
A method of manufacturing a surface acoustic wave filter, the method comprising:
A method of manufacturing a packaged surface acoustic wave filter chip, the method comprising:
Dependencies are inferred from the claim text.