Ultrasound vibrating-type defect detection apparatus and wire defect detection system
AssigneeYamaha Robotics Holdings Co., Ltd.
InventorsMichael Kirkby, Hiroshi Munakata, Takuya Adachi
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AssigneeYamaha Robotics Holdings Co., Ltd.
InventorsMichael Kirkby, Hiroshi Munakata, Takuya Adachi
Estimating the term…
An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.
An ultrasound vibrating-type defect detection apparatus for detecting a defect in an inspection object, the ultrasound vibrating-type defect detection apparatus comprising:
A wire defect detection system for detecting a defect in a wire of a semiconductor apparatus, which comprises a substrate, a semiconductor element attached to the substrate, and the wire connecting an electrode of the semiconductor element and an electrode of the substrate, or one electrode of the semiconductor element and another electrode of the semiconductor element, the wire defect detection system comprising:
Dependencies are inferred from the claim text.