Dicing system and dicing method

A dicing system comprising:

• a protection layer forming apparatus that forms a protection layer on a surface of a substrate;
• a patterning apparatus that patterns the protection layer to form a mask;
• a plasma treatment apparatus that plasma etches the substrate exposed from the mask to form a plurality of element chips;
• a measuring apparatus that obtains at least one processing data selected from the group consisting of first processing data relating to the protection layer, second processing data relating to the mask, and third processing data relating to the element chips;
• and
• a control unit that operates at least one apparatus selected from the group consisting of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on a recipe that is defined for each of the apparatuses,
• wherein the control unit determines, based on the second processing data, whether or not to modify the recipe, modifies at least one of the recipes if the recipe needs to be modified, and operates at least one apparatus selected from the group consisting of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on the modified recipe.

A dicing system comprising:

• a protection layer forming apparatus that forms a protection layer on a surface of a substrate;
• a patterning apparatus that patterns the protection layer to form a mask;
• a plasma treatment apparatus that plasma etches the substrate exposed from the mask to form a plurality of element chips;
• a measuring apparatus that obtains at least one processing data selected from the group consisting of first processing data relating to the protection layer, second processing data relating to the mask, and third processing data relating to the element chips;
• a control unit that operates at least one apparatus selected from the group consisting of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on a recipe that is defined for each of the apparatuses;
• a simulator that calculates, based on the second processing data and the recipe relating to the plasma treatment apparatus, predicted data relating to the element chip;
• and
• a calculation unit that calculates a difference between the predicted data and the third processing data,
• wherein the control unit determines, based on at least one of the obtained at least one processing data, whether or not to modify the recipe, modifies at least one of the recipes if the recipe needs to be modified, and operates at least one apparatus selected from the group consisting of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on the modified recipe.

A dicing method comprising:

• a protection layer forming step of forming, based on a first recipe, a protection layer on a surface of a substrate;
• a patterning step of patterning, based on a second recipe, the protection layer to form a mask;
• a plasma treatment step of plasma etching, based on a third recipe, the substrate exposed from the mask to form a plurality of element chips;
• a measuring step of obtaining at least one processing data selected from the group consisting of first processing data relating to the protection layer, second processing data relating to the mask, and third processing data relating to the element chips;
• a recipe modifying step of determining, based on at least one of the obtained at least one processing data, whether or not to modify the second recipe, and modifying the second recipe if the second recipe needs to be modified;
• and
• a feedback step of feeding back the modified second recipe to control of the patterning step.

A dicing method comprising:

• a protection layer forming step of forming, based on a first recipe, a protection layer on a surface of a substrate;
• a patterning step of patterning, based on a second recipe, the protection layer to form a mask;
• a plasma treatment step of plasma etching, based on a third recipe, the substrate exposed from the mask to form a plurality of element chips;
• a measuring step of obtaining at least one processing data selected from the group consisting of first processing data relating to the protection layer, second processing data relating to the mask, and third processing data relating to the element chips;
• a recipe modifying step of determining, based on at least one of the obtained at least one processing data, whether or not to modify the third recipe, and modifying the third recipe if the third recipe needs to be modified;
• and
• a feedback step of feeding back the modified third recipe to control of the plasma treatment step.

A dicing method comprising:

• a protection layer forming step of forming, based on a first recipe, a protection layer on a surface of a substrate;
• a patterning step of patterning, based on a second recipe, the protection layer to form a mask;
• a plasma treatment step of plasma etching, based on a third recipe, the substrate exposed from the mask to form a plurality of element chips;
• a measuring step of obtaining second processing data relating to the mask;
• a third recipe modifying step of determining, based on the obtained second processing data, whether or not to modify the third recipe, and modifying the third recipe if the third recipe needs to be modified;
• and
• a feedforward step of feeding forward the modified third recipe to control of the plasma treatment step.