Lithography device, lithography method, and article manufacturing method

A lithography device comprising:

• a pattern forming unit configured to form a pattern in a shot region on a substrate held by a substrate holding unit by using a pattern unit of a mold,
• an acquisition unit configured to acquire relationships among an amount of positional deviation of the substrate relative to the substrate holding unit, a holding force applied to at least a part of the substrate to hold the substrate, and an overlapping error between the substrate and the pattern unit,
• a first measurement unit configured to measure the amount of positional deviation of the substrate relative to the substrate holding unit,
• a second measurement unit configured to measure an amount of positional deviation of the substrate relative to the mold,
• a substrate moving unit configured to move the substrate holding unit;
• and
• a control unit configured to control the holding force applied to at least the part of the substrate to hold the substrate to reduce the overlapping error between the substrate and the pattern unit on the basis of the amount of positional deviation measured by the first measurement unit and the relationships acquired by the acquisition unit;
• wherein the control unit is configured to control a position of the substrate holding unit by using the substrate moving unit based on the amount of positional deviation of the substrate relative to the mold measured by the second measurement unit.