Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)
AssigneeIntel Corporation
InventorsChia-Pin Chiu, Kaveh Hosseini, Omkar Karhade, Tim Tri Hoang
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment, an optoelectronic system comprises a first substrate, a second substrate over the first substrate, a micro-ring resonator (MRR) over the second substrate, a heater integrated into the MRR, a cladding over the MRR, an opening through the first substrate and the second substrate to expose a bottom surface of the MRR, and a base spanning across the opening.
Claims20
An optoelectronic system, comprising:
- a first substrate;
- a second substrate over the first substrate;
- a micro-ring resonator (MRR) over the second substrate;
- a heater integrated into the MRR;
- a cladding over the MRR;
- an opening through the first substrate and the second substrate to expose a bottom surface of the MRR;
- and
- a base spanning across the opening.
A method of forming an optoelectronic system, comprising:
- forming a micro-ring resonator (MRR) with a heater on a substrate, wherein the substrate is a silicon on insulator (SOI) substrate with a silicon substrate and an oxide layer over the silicon substrate, and wherein a cladding is provided over and around the MRR;
- applying a mask to a bottom surface of the silicon substrate, wherein an opening of the mask is aligned with the MRR;
- etching through the silicon substrate and the oxide layer to expose a bottom surface of the MRR;
- and
- attaching a base to the silicon substrate that spans across a hole in the silicon substrate.
An optoelectronic system, comprising:
- a package substrate;
- a photonics integrated circuit (PIC) coupled to the package substrate, wherein the PIC comprises:
- a first substrate;
- a second substrate over the first substrate;
- a micro-ring resonator (MRR) over the second substrate;
- a heater integrated into the MRR;
- a cladding over the MRR;
- an opening through the first substrate and the second substrate to expose a bottom surface of the MRR;
- and
- a base spanning across the opening;
- and
- an electronic integrated circuit (EIC) coupled to the PIC.
Dependencies are inferred from the claim text.