Temperature adjusting device, electronic component handling apparatus, and electronic component test apparatus

A temperature adjusting device that adjusts a temperature of a device under test (DUT) electrically connected to a socket, the temperature adjusting device comprising:

• a fluid connector connected to a fluid supply source that supplies a fluid;
• a heat exchanger thermally connected to the DUT or a carrier holding the DUT in a state that the DUT or the carrier is pressed against the socket;
• a first flow path passing through an inside of the heat exchanger;
• a first swirl flow forming part that swirls a flow of the fluid to form a first swirl flow and supplies the first swirl flow to the first flow path;
• a second flow path disposed on an upstream side of the first flow path and connected to the first flow path, wherein
• the first swirl flow swirls along an inner surface of the first flow path around a first central axis of the first flow path,
• the second flow path has a second central axis that does not intersect the first central axis, and
• the first swirl flow forming part is a first connection part where the first flow path and the second flow path are connected to each other.