Facade system for thermally conditioning buildings
AssigneeUniversity of Massachusetts
InventorsAjla Aksamija, Zlatan Aksamija
Life of this patent
Estimating the term…
Abstract
An architectural structure having: a wall of a room of the architectural structure; and a panel integrated into the wall, wherein the panel includes thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel, wherein: the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall; and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area.
Claims15
An architectural structure, comprising:
- a wall of a room of the architectural structure;
- and a panel integrated into the wall, wherein the panel comprises thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel,
- wherein:
- the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall;
- and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area,
- wherein the wall defines a panel aperture, and the panel is disposed within the panel aperture, wherein the wall defines a wall interior surface and a wall exterior surface that are depthwise spaced apart from each other, wherein the panel defines a panel exterior surface and a panel interior surface that are depthwise spaced apart from each other,
- wherein:
- the wall exterior and interior surfaces and the panel exterior and interior surfaces are parallel to each other;
- and the panel exterior surface is flush with, or continuous with, the wall exterior surface to define the common heat sink for the TEC grid, and
- wherein:
- a panel depth of the panel is greater than a wall depth of the wall so that the panel interior surface is depthwise spaced apart from the wall interior surface.
An architectural structure, comprising:
- a wall of a room of the architectural structure;
- and a panel integrated into the wall, wherein the panel comprises thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel,
- wherein:
- the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall;
- and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area,
- wherein the wall defines a panel aperture, and the panel is disposed within the panel aperture, wherein the wall defines a wall interior surface and a wall exterior surface that are depthwise spaced apart from each other, wherein the panel defines a panel exterior surface and a panel interior surface that are depthwise spaced apart from each other,
- wherein:
- the wall exterior and interior surfaces and the panel exterior and interior surfaces are parallel to each other;
- and the panel exterior surface is flush with, or continuous with, the wall exterior surface to define the common heat sink for the TEC grid, and
- wherein:
- the panel defines a panel sandwich structure formed of a plurality of panel layers that are parallel to each other, wherein the TEC grid is a center panel layer located at or near a panel depthwise center of the panel, and
- the plurality of panel layers are defined by:
- the panel exterior surface and the panel interior surface, which define respective first and second heat sink panels;
- first and second sets of heat fins, which are respectively coupled to the first and second heat sink panels;
- first and second heat fin caps, which are respectively coupled to the first and second sets of heat fins;
- and
- first and second conductors, which are respectively coupled between the first and second heat fin caps and the TEC grid,
- wherein a thermal conductive circuit is defined between the panel exterior and interior surfaces, the first and second sets of heat fins, and the first and second heat fin caps.
Dependencies are inferred from the claim text.