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US 12,434,456 B2Granted
Laminated member
AssigneeAGC Inc.
InventorsYu Hanawa, Shuhei Ogawa, Seiji Inaba, Hiroyuki Yamamoto
Life of this patent
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Abstract
The present invention relates to a laminated member including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer including a resin and lying on the glass member; and a Si—SiC member lying on the bonding member, in which the Si—SiC member has an average linear expansion coefficient α at from 20° C. to 200° C. of from 2.85 ppm/° C. to 4.00 ppm/° C.
Claims20
A laminated member, comprising:
- a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more and a thickness in a range of 3 mm to 40 mm;
- a bonding layer comprising a resin and formed on the glass member;
- and
- a Si—SiC member formed on the bonding layer and having a thickness in a range of 0.5 to 15mm, such that the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C.
1 more element
Dependencies are inferred from the claim text.