Methods for joining a first thermoplastic substrate with a second thermoplastic substrate
AssigneeThe Boeing Company
InventorsYing Shi, Alexander M. Rubin, Gregory J. Hickman
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AssigneeThe Boeing Company
InventorsYing Shi, Alexander M. Rubin, Gregory J. Hickman
Estimating the term…
A method for joining a first thermoplastic substrate and a second thermoplastic substrate, each including a polyaryletherketone material having a first melting temperature. The method includes co-consolidating a first semicrystalline thermoplastic film with the first thermoplastic substrate to yield a first co-consolidated structure. The first semicrystalline thermoplastic film defines a first bonding surface of the first co-consolidated structure and includes a polyaryletherketone material having a second melting temperature that is less than the first melting temperature. The method further includes co-consolidating a second semicrystalline thermoplastic film with the second thermoplastic substrate to yield a second co-consolidated structure. The second semicrystalline thermoplastic film defines a second bonding surface of the second co-consolidated structure and includes a polyaryletherketone material having a third melting temperature that is less than the first melting temperature. The method further includes fusing the first bonding surface to the second bonding surface. The method yields a stacked structure.
A method for joining a first multi-ply thermoplastic composite part with a second multi-ply thermoplastic composite part, the method comprising:
A method for joining a first multi-ply thermoplastic composite part with a second multi-ply thermoplastic composite part, the method comprising:
Dependencies are inferred from the claim text.