Electrostatic chuck apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorYoshiaki Moriya
Life of this patent
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Abstract
An electrostatic chuck apparatus is provided that is capable of effectively reducing temperature imbalance of a wafer substrate that is heated to a high temperature. The electrostatic chuck apparatus includes a base including a cooling flow path through which a refrigerant may flow, an adiabatic layer on the base, a uniform heating plate on the adiabatic layer, a heating element between the adiabatic layer and the uniform heating plate, an insulating layer on the uniform heating plate and including a ceramic, a conductive layer on the insulating layer and having an area smaller than an area of the insulating layer, and a dielectric layer on the conductive layer and including a ceramic.
Claims20
An electrostatic chuck apparatus comprising:
- a base comprising a cooling flow path, the cooling flow path configured to have a refrigerant flow therethrough;
- an adiabatic layer on the base;
- a uniform heating plate on the adiabatic layer;
- a heating element between the adiabatic layer and the uniform heating plate;
- an insulating layer on the uniform heating plate, the insulating layer comprising a ceramic;
- a conductive layer on the insulating layer, the conductive layer having an area smaller than an area of the insulating layer;
- and
- a dielectric layer on the conductive layer, the dielectric layer comprising a ceramic,
- wherein the uniform heating plate has a uniform thickness and comprises a material having different thermal conductivity in a vertical direction and a horizontal direction with respect to a thickness direction of the heating element.
An electrostatic chuck apparatus comprising:
- a base comprising a cooling flow path;
- an adiabatic layer on the base;
- a heating element in the adiabatic layer;
- a uniform heating plate on the adiabatic layer, the uniform heating plate being configured to uniformly transfer heat from the adiabatic layer to an upper portion of the uniform heating plate;
- an insulating layer on the uniform heating plate;
- a conductive layer on the insulating layer, the conductive layer having an area smaller than an area of the insulating layer;
- and
- a dielectric layer on the conductive layer, the dielectric layer covering at least a top surface of the conductive layer,
- wherein the uniform heating plate has a uniform thickness and comprises a material having different thermal conductivity in a vertical direction and a horizontal direction with respect to a thickness direction of the heating element.
An electrostatic chuck apparatus comprising:
- a base comprising a cooling flow path, the cooling flow path configured to have a refrigerant flow therethrough;
- an adiabatic layer on the base;
- a heating element within the adiabatic layer;
- a uniform heating plate on the adiabatic layer, the uniform heating plate being configured to uniformly transfer heat from the adiabatic layer to an upper portion of the uniform heating plate;
- an insulating layer on the uniform heating plate, the insulating layer comprising a ceramic;
- a conductive layer on the insulating layer, the conductive layer having an area smaller than an area of the insulating layer;
- a dielectric layer on the conductive layer, the dielectric layer comprising a ceramic;
- and
- a dense layer on the dielectric layer,
- wherein the uniform heating plate has a uniform thickness and comprises a material having different thermal conductivity in a vertical direction and a horizontal direction with respect to a thickness direction of the heating element.
Dependencies are inferred from the claim text.