Compact hybrid heat capture system in an information handling system

A system comprising:

• a cooling distribution unit to provide a cooling liquid;
• and
• an information handling system to receive the cooling liquid from the cooling distribution unit, the information handling system including:
• a front door including a first frame;
• a main portion including a second frame, a component node having multiple components, and a first channel;
• and
• a rear portion including a third frame, a cooling coil, a cooling fan, and a second channel, wherein the information handling system is airtight when the first frame is in physical communication with a first end of the second frame and the third frame is in physical communication with a second end of the second frame, wherein an airflow circulates within the information handling system to cool the components in the component node, wherein the airflow circulates from the cooling coil to the cooling fan, through the second channel, through the first channel, through the component node, and back through the cooling coil.

An information handling system comprising:

• a main portion including a first frame, a component node having multiple components, and a first channel;
• a front door including a second frame and an airflow director, wherein the airflow director angles an airflow toward the component node;
• and
• a rear portion including a third frame, a cooling coil, a cooling fan, a second channel, and directional vanes to direct the airflow from the cooling fan toward the second channel, wherein the information handling system is airtight when the second frame is in physical communication with a first end of the first frame and the third frame is in physical communication with a second end of the first frame, wherein the airflow circulates within the information handling system to cool the components in the component node, wherein the airflow circulates from the cooling coil, to the cooling fan, through the second channel, through the first channel, through the component node, and back through the cooling coil.