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US 12,431,858 B2Granted
Electronic structure and method of manufacturing the same
AssigneeWin Semiconductors Corp.
InventorsChia-Ta Chang, Po-Wei Ting
Life of this patent
Estimating the term…
Abstract
An electronic structure is provided. The electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductors are disposed on the substrate. The bump structure is disposed on at least one of the conductors. The protective layer is disposed on the conductors. A region is exposed between the conductors. A method of manufacturing the electronic structure is also provided.
Claims14
An electronic structure, comprising:
- a substrate;
- a first conductor disposed on the substrate having a first top surface and a first side surface;
- a second conductor electrically connected to the first conductor and having a second top surface and a second side surface;
- an insulator covering the first top surface and the first side surface of the first conductor;
- a protective layer covering the second top surface of the second conductor and exposing the second side surface of the second conductor;
- and
- a bump structure disposed on the second conductor;
- wherein the protective layer comprises a metal material;
- wherein the first conductor is in contact with the second conductor;
- and
- wherein the insulator covers a first portion of the first top surface and exposes a second portion of the first top surface.
8 more elements
An electronic structure, comprising:
- a substrate;
- a plurality of conductors disposed on the substrate;
- a bump structure disposed on at least one of the plurality of conductors;
- a protective layer disposed on the plurality of conductors and exposing a region between the plurality of conductors;
- an excitation electrode disposed on the substrate;
- and
- a cover disposed on the excitation electrode and forming a space on the excitation electrode;
- wherein the protective layer is disposed on a top surface of the plurality of conductors and exposes a side surface of the plurality of conductors;
- wherein the at least one of the conductors extends onto the cover, and the bump structure is disposed on the cover.
6 more elements
Dependencies are inferred from the claim text.