Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell

A computer-readable medium storing a set of instructions thereon, which when executed by a processor cause the processor to:

• receive a recipe for a die included in a wafer, each die of the plurality of chips being divided into a plurality of tiles, each tile including a NCEM-enabled registration cell and a plurality of non-contact electronic measurement (NCEM)-enabled fill cells, the recipe including a position for the die within the wafer and a position for each of the NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells;
• determine an expected position of a NCEM-enabled registration cell included in a tile of the plurality of tiles;
• scan the NCEM-enabled registration cell using an electron beam;
• receive an indication of a response of the NCEM-enabled registration cell to the scanning;
• determine an actual position of the NCEM-enabled registration cell using the response;
• align the electron beam using the actual position of the NCEM-enabled registration cell;
• sequentially direct the aligned electron beam toward each of NCEM-enabled fill cells of the plurality of NCEM-enabled fill cells within the tile of the plurality of tiles;
• receive an indication of a response of each of the NCEM-enabled fill cells to the aligned electron beam;
• and
• provide an indication of the response to a processor.

A computer-readable medium storing a set of instructions thereon, which when executed by a processor cause the processor to:

• receive a recipe for a die included in a wafer, the die including a plurality of chips, each of the chips being divided into a plurality of tiles, each tile including a NCEM-enabled registration cell and a plurality of non-contact electronic measurement (NCEM)-enabled fill cells, the recipe including a position for the die within the wafer, contents of the wafer, and a position for the contents of the wafer;
• receive a selection of an array of chips included in the wafer to test using a non-contact electronic measurement (NCEM), each chip of the array being configured to be identical to one another;
• identify a target region in each of the chips included in the array,
• direct an electron beam toward the target region for each chip in the array;
• receive an indication of a response of each target region to the electron beam;
• compare the received indications to one another to determine whether there are any outlying indications;
• and
• provide a result of the comparison to a processor.