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US 12,431,264 B2Granted
Multi-layered, shielded and grounded cables and related methods
AssigneeMolex Incorporated
InventorsJared D. Sullivan, Michael Mcgee, Eran J. Jones, David Gader, Andrew J. Wehrli, Todd D. Ward, Gianni R. Bardella, Ayman Isaac, Darian Schulz
Life of this patent
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Abstract
Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
Claims18
An assembly comprising:
- a printed circuit board;
- a cable comprising a signal conductor and a shield layer surrounding the signal conductor;
- and
- a connective structure mounted to the printed circuit board, the connective structure comprising a conductive strap and a pair of supporting structures on each side of the conductive strap,
- wherein the conductive strap wraps around a portion of the cable and comprises a notch, wherein the notch receives a solder element configured to communicatively couple the conductive strap to the shield layer of the cable, and
- wherein the pairs of supporting structures are connected with the printed circuit board to form a ground path from the cable to an electrical ground connected with the printed circuit board.
3 more elements
An assembly comprising:
- a printed circuit board;
- at least one cable comprising at least one signal conductor and a shield layer;
- a connective structure mounted over the at least one cable and to the printed circuit board, the connective structure comprising a notch and at least two substantially symmetrical ground paths from the shield layer of the at least one cable to the printed circuit board;
- and
- a solder element positioned in the notch to electrically couple the connective structure to the shield layer of the at least one cable.
2 more elements
An assembly comprising:
- a printed circuit board;
- a cable comprising a signal conductor and a shield layer surrounding the signal conductor;
- and
- a connective structure mounted to the printed circuit board, the connective structure comprising a conductive strap made of a conductive element and a pair of supporting structures on each side of the conductive strap, wherein
- the conductive strap is coupled with the cable by a connective element and the supporting structures are coupled with the printed circuit board, and
- the connective element comprises one or more of:
- a solder element configured to form a connection to an outer layer of the cable and the connective structure;
- a nub or protrusion extending from an end of the cable into a notch of the connective structure configured to receive the connective element;
- or
- any combination thereof.
7 more elements
Dependencies are inferred from the claim text.