Efficient signaling scheme for high-speed ultra short reach interfaces

A semiconductor device package, comprising:

• a multi-chip module (MCM) comprising:
• a common chip package substrate;
• a first group of IC chips coupled to the common chip package substrate and comprising a first integrated circuit (IC) chip to transmit first data off the first IC chip;
• and
• a transfer IC chip coupled to the common chip package substrate in a planar configuration with the first group of IC chips, the transfer IC chip packaged with the first group of IC chips, the transfer IC chip to receive the first data from the first IC chip via at least one first link, the transfer IC chip, configured as a repeater, comprising switching circuitry to selectively forward the first data to one of a first output interface and a second output interface, the first output interface communicatively coupled to a third IC chip of a second group of IC chips via at least one second link, the second group of IC chips being coupled to the common chip package substrate in a planar configuration with the first group of IC chips and the transfer IC chip, the second output interface configured to output the first data from the MCM;
• wherein the at least one first link further comprises a first set of ultra short reach (USR) signaling links to connect the first group of IC chips to the transfer IC chip;
• and
• the at least one second link further comprises a second set of USR signaling links to connect the second group of IC chips to the transfer IC chip;
• wherein each of the first set of USR signaling links and each of the second set of USR signaling links comprises a trace length of less than one inch.

A semiconductor device, comprising:

• a chip package substrate;
• and
• a first integrated circuit (IC) chip coupled to the chip package substrate to receive first data, the first IC chip to package in a multi-chip module (MCM) with a first group of IC chips and a second group of IC chips, the first IC chip comprising an input interface to receive the first data from the first group of IC chips via at least one first link, the first IC chip configured to mount to the chip package substrate in a planar orientation with the first group of IC chips and the second group of IC chips, the first IC chip, configured as a repeater, comprising switching circuitry to selectively forward the first data to one of a first output interface and a second output interface, the first output interface to couple to the second group of IC chips via at least one second link, the second output interface configured to output the first data from the MCM;
• wherein the at least one first link further comprises a first set of ultra short reach (USR) signaling links to connect the first group of IC chips to the first IC chip;
• and
• the at least one second link further comprises a second set of USR signaling links to connect the second group of IC chips to the first IC chip, wherein each of the first set of USR signaling links and each of the second set of USR signaling links comprises a trace length of less than one inch.