Electronic device

Abstract

An electronic device, including a substrate, a package component, a first sensor chip, and a second sensor chip, is provided. The substrate has an inner space and a first through hole communicated with the inner space. The package component is disposed on the substrate and forms a front chamber and a back chamber together with the substrate. The package component has an opening. The front chamber is communicated with an outside air by the opening. The inner space constitutes at least part of the back chamber, and the back chamber is communicated with the front chamber by the first through hole. The first sensor chip is disposed on the substrate and covers the first through hole to separate an airflow in the front chamber and an airflow in the back chamber. The second sensor chip is disposed on the substrate and located in the back chamber.

Dependencies are inferred from the claim text.