LED lighting apparatus with heat dissipating plate
OwnerEun Hong Parkinventor
Life of this patent
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Abstract
Provided is a Light Emitting Diode (LED) lighting apparatus, and more particularly, an LED lighting apparatus that effectively dissipates heat generated from a single LED. The LED lighting apparatus according to an exemplary embodiment includes a single LED which emits light, a printed circuit board which includes a base plate having a first surface and a second surface opposing each other, and in which the single LED is mounted on the first surface, and a heat dissipating plate which is provided on the second surface to dissipate the heat generated from the single LED. And the printed circuit board and the heat dissipating plate may be welded and bonded to each other.
Claims12
A Light Emitting Diode (LED) lighting apparatus comprising:
- a single LED configured to emit light;
- a printed circuit board which comprises a base plate having a first surface and a second surface opposing each other, and in which the single LED is mounted on the first surface;
- and
- a heat dissipating plate provided on the second surface to dissipate heat generated from the single LED,
- wherein the printed circuit board and the heat dissipating plate are welded and bonded to each other,
- wherein the single LED comprises a heat transfer pad provided on a bottom surface of the single LED, which opposes the first surface of the printed circuit board,
- wherein the printed circuit board further comprises:
- a first intermediate pad provided on the first surface and connected to the heat transfer pad;
- a second intermediate pad provided on the second surface so as to correspond to the first intermediate pad;
- and
- a heat transfer via hole passing through the base plate so as to thermally connect the first intermediate pad and the second intermediate pad to each other.
A Light Emitting Diode (LED) lighting apparatus comprising:
- a single LED configured to emit light;
- a printed circuit board which comprises a base plate having a first surface and a second surface opposing each other, and in which the single LED is mounted on the first surface;
- a heat dissipating plate provided on the second surface to dissipate heat generated from the single LED, and having a top surface smaller than a bottom surface of the printed circuit board;
- and
- an intermediate plate provided between the printed circuit board and the heat dissipating plate, and having a bottom surface larger than the top surface of the heat dissipating plate,
- wherein the intermediate plate and the printed circuit board, and the intermediate plate and the heat dissipating plate, are welded and bonded to each other,
- wherein the single LED comprises a heat transfer pad provided on a bottom surface of the single LED, which opposes the first surface of the printed circuit board,
- wherein the printed circuit board further comprises:
- a first intermediate pad provided on the first surface and connected to the heat transfer pad;
- a second intermediate pad provided on the second surface so as to correspond to the first intermediate pad;
- and
- a heat transfer via hole passing through the base plate so as to thermally connect the first intermediate pad and the second intermediate pad to each other.
Dependencies are inferred from the claim text.