US 12,428,888 B1Granted

Electrical bonding door hinges

AssigneeChatsworth Products, Inc.

InventorsWilliam Drew Krietzman, Preston Ellis Hennrich, John Wayne Robertson

Life of this patent

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Abstract

A hinge assembly includes first and second hinge units and an electrically conductive pin. The first hinge unit is mounted to a door of an enclosure and includes a pin support comprising a barrel, a knuckle, or both, a pin receptacle arranged and rotatable in the pin support, and an electrically conductive structure disposed at least partly inside the pin support and adjacent the pin receptacle. The second hinge unit is carried on the pin and is mountable to a frame structure. The second hinge unit can be removed from the first hinge unit to enable removal of the door. The electrically conductive structure is biased against the pin, remains in contact while the pin rotates, and is electrically connected to the door as the pin rotates while the first hinge unit remains mounted to the door.

Claims20

Dependent claims

A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising:

(a) a first hinge unit, adapted to be mounted to a door of the electronic equipment enclosure, that includes:
(i) a pin support comprising a barrel,
(ii) a pin receptacle arranged in the pin support, and
(iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle;
(b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein;
and
(c) a removable second hinge unit carried on the pin and adapted to be mounted to a frame structure of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure;
(d) wherein:
(i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and
(ii) the electrically conductive bonding element is electrically connected to the door so long as the first hinge unit is mounted to the door,
(iii) such that the pin is electrically bonded to the door, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the door;
(f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(g) wherein the electrically conductive bonding element is a bonding contact spring biased against the cylindrical surface of the pin;
and
(h) wherein the bonding contact spring is a simple flat spring, disposed in a recess in the barrel of the pin support, that is bowed in the middle and is thereby biased against the cylindrical surface of the pin.

13 more elements

A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising:

(a) a first hinge unit, adapted to be mounted to a door of the electronic equipment enclosure, that includes:
(i) a pin support comprising a barrel,
(ii) a pin receptacle arranged in the pin support, and
(iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle;
(b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein;
and
(c) a removable second hinge unit carried on the pin and adapted to be mounted to a frame structure of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure;
(d) wherein:
(i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and
(ii) the electrically conductive bonding element is electrically connected to the door so long as the first hinge unit is mounted to the door,
(iii) such that the pin is electrically bonded to the door, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the door;
(f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(g) wherein the electrically conductive bonding element is a bonding contact spring biased against the cylindrical surface of the pin;
and
(h) wherein the bonding contact spring is a wire spring, staked at one end in a groove in the barrel of the pin support, that applies a constant support against the cylindrical surface of the pin.

13 more elements

A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising:

(a) a first hinge unit, adapted to be mounted to a door of the electronic equipment enclosure, that includes:
(i) a pin support comprising a barrel,
(ii) a pin receptacle arranged in the pin support, and
(iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle;
(b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein;
and
(c) a removable second hinge unit carried on the pin and adapted to be mounted to a frame structure of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure;
(d) wherein:
(i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and
(ii) the electrically conductive bonding element is electrically connected to the door so long as the first hinge unit is mounted to the door,
(iii) such that the pin is electrically bonded to the door, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the door;
(f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(g) wherein the pin is electrically bonded to the second hinge unit such that the second hinge unit is electrically bonded to the door via bonding between the second hinge unit and the pin, bonding between the pin and the electrically conductive bonding element, bonding between the electrically conductive bonding element and the pin support, and bonding between the pin support and the door;
(h) wherein the second hinge unit is electrically connected to the frame structure so long as the second hinge unit is mounted to the frame structure such that the frame structure is electrically bonded to the door via bonding between the frame structure and the second hinge unit, bonding between the second hinge unit and the pin, bonding between the pin and the electrically conductive bonding element, bonding between the electrically conductive bonding element and the pin support, and bonding between the pin support and the door;
and
(i) wherein the second hinge unit includes a pin housing that is press fit into an opening provided in a structural member of the frame structure.

14 more elements

A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising:

(a) a first hinge unit, adapted to be mounted to a door of the electronic equipment enclosure, that includes:
(i) a pin support comprising a barrel,
(ii) a pin receptacle arranged in the pin support, and
(iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle;
(b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein;
and
(c) a removable second hinge unit carried on the pin and adapted to be mounted to a frame structure of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure;
(d) wherein:
(i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and
(ii) the electrically conductive bonding element is electrically connected to the door so long as the first hinge unit is mounted to the door,
(iii) such that the pin is electrically bonded to the door, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the door;
(f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state;
(g) wherein the pin is electrically bonded to the second hinge unit such that the second hinge unit is electrically bonded to the door via bonding between the second hinge unit and the pin, bonding between the pin and the electrically conductive bonding element, bonding between the electrically conductive bonding element and the pin support, and bonding between the pin support and the door;
and
(h) wherein the second hinge unit includes a pin housing supporting a return spring that biases the pin into position in the pin receptacle but which, when a biasing force is overcome, permits the pin to be withdrawn from the pin receptacle such that the second hinge unit may be removed from the first hinge unit.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/430,741Filed 2 Feb 2024 · continuation
Priority: 2 Feb 2021
Granted: 30 Sep 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

E05D 11/0081
Additional features or accessories of hinges: for transmitting energy, e.g. electrical cable routing
E05D 5/12
Pins, sockets or sleeves; Removable pins: securing pins in sockets, movably or not
E05D 7/1011
By axially moving free pins, balls or sockets: biased by free springs
E05D 11/1014
Devices for preventing movement between relatively-movable hinge parts: for maintaining the hinge in only one position, e.g. closed