Back to results
US 12,428,830 B2Granted
Modular structure
AssigneeUpshot Intellectual Holdings Limited
InventorsJohn Miles, James Pickance
Life of this patent
Estimating the term…
Abstract
A modular structural element (20) which is arranged to be connected to another such element so as to form an assembled structure, wherein the modular structural element is of substantially square outline or of substantially hexagonal or half-hexagonal outline, and the element comprises a principal height dimension and a principle lateral dimension, wherein, a ratio of the two said principal dimensions is no more than 6.
Claims17
A kit of parts which kit is arranged to be connected together so as to form an assembled structure, wherein the kit comprises:
- a modular structural element which is of substantially square outline or of substantially hexagonal or half-hexagonal outline, and the element comprises a principal height dimension and a principal lateral dimension, wherein, a ratio of the two said principal dimensions is no more than 6;
- two interplates which are each of plate configuration and arranged to be located at opposite distal ends of a modular structural element, and the interplate has a larger principal lateral dimension than the modular structural element;
- a plurality of poles which have a length which matches the principal height dimension of modular element;
- wherein, the poles arranged to be located externally of the structural modular element between two interplates.
1 more element
Dependencies are inferred from the claim text.