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US 12,428,744 B2Granted
Nickel electroplating compositions for rough nickel
AssigneeRohm and Haas Electronic Materials LLC
InventorsWeigang Wu, Fai Lung Ting
Life of this patent
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Abstract
Nickel electroplating compositions containing thiourethanes deposit rough nickel on substrates. The rough nickel can be electroplated over wide current density ranges. The rough nickel deposits enable improved adhesion to other metal layers in contrast to many conventional nickel deposits.
Claims14
A method of electroplating nickel metal on a substrate:
- a) providing the substrate;
- b) contacting the substrate with a nickel electroplating composition, wherein the nickel electroplating composition comprises nickel ions and a thiourethane having a formula:
- wherein R1 and R2 are independently chosen from hydrogen, linear or branched hydroxy (C1-C6)alkyl, linear or branched carboxy (C1-C6)alkyl, linear or branched amino (C1-C6)alkyl, (C5-C6)cycloalkyl ring, or R2 can be sulfur, and G is carbon or nitrogen, and salts of the thiourethanes, the nickel electroplating composition is free of alloying metals;
- and
- c) depositing a nickel layer on the substrate, wherein the nickel layer comprises a Sa ≥70 nm and a Sdr≥4%.
2 more elements
Dependencies are inferred from the claim text.