Film forming apparatus and film forming method

A film forming apparatus comprising:

• a processing container for accommodating a plurality of substrates;
• a substrate holder horizontally disposed in the processing container and configured to hold the substrates, wherein a plurality of stages are arranged along a circumferential direction on the substrate holder, the stages supporting the substrates, and wherein a separation wall and an exhaust slit are provided between adjacent stages on the substrate holder, and the adjacent stages are physically separated by the separation wall;
• a rotating and revolving mechanism configured to rotate the plurality of substrates on the substrate holder and revolve the plurality of substrates on the substrate holder along the circumferential direction;
• a sputtered particle emitting mechanism having a plurality of cathodes each having a target that emit Si as sputtered particles to the plurality of substrates held by the substrate holder, and configured to form an Si film on the substrates;
• an oxidation treatment area provided between the cathodes adjacent to each other, where oxidation treatment is performed on the Si film on the substrate;
• and
• a nitriding treatment area provided between the cathodes adjacent to each other, where nitriding treatment is performed on the Si film on the substrate,
• wherein a laminated film of SiO2 films and SiN films is formed by sequentially and repeatedly performing, on each of the substrates, the formation of the Si film using the cathodes, the oxidation treatment of the Si film in the oxidation treatment area, the formation of the Si film using the cathodes, and the nitriding treatment of the Si film in the nitriding treatment area while rotating and revolving the plurality of substrates held by the substrate holder using the rotating and revolving mechanism.

A film forming method for forming a film using a film forming apparatus including a processing container for accommodating a plurality of substrates;

• a substrate holder horizontally disposed in the processing container and configured to hold the substrates, wherein a plurality of stages are arranged along a circumferential direction on the substrate holder, the stages supporting the substrates, and wherein a separation wall and an exhaust slit are provided between adjacent stages on the substrate holder, and the adjacent stages are physically separated by the separation wall;
• a rotating and revolving mechanism configured to rotate the plurality of substrates on the substrate holder and revolve the plurality of substrates on the substrate holder along the circumferential direction;
• and a sputtered particle emitting mechanism configured to emit sputtered particles to the plurality of substrates held by the substrate holder,
• the method comprising:
• loading the plurality of substrates into the processing container and holding the substrates on the substrate holder;
• rotating and revolving the plurality of substrates held by the substrate holder using the rotating and revolving mechanism;
• and
• performing sputtering film formation by emitting sputtered particles from the sputtered particle emitting mechanism while rotating and revolving the plurality of substrates.