Method for producing layers with improved uniformity in coating systems with horizontally rotating substrate guiding

A method of depositing uniform layers on a rotationally moved substrate by magnetron sputtering, in which

• a) at least one substrate is arranged on a turntable in a vacuum chamber to enable a coating on a rotational movement of the substrate;
• and
• b) at least one layer is deposited on the at least one substrate by utilizing at least one coating source comprising a linearly extended dual magnetron source, with the layers of source material of the magnetron electrodes being formed by sputter gas,
• wherein the magnetron electrodes have a substantially asymmetrically poled magnet configuration;
• and wherein one of the magnetron electrodes has a polarity N-S-N and the other magnetron electrode has a polarity S-N-S;
• wherein the at least one coating source has an inhomogeneous plasma density that effects an inhomogeneous removal rate of the source material, and the at least one coating source has a generator with a settable pulse shape and pulse frequency in a frequency range of 20-60 kHz to control thickness of the layer, and wherein the settable pulse shape comprises sinusoidal pulses;
• and
• wherein the deposition of layers is not mediated by one or more correction masks to assist in the production of uniform distribution of the deposited layers.