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US 12,427,750 B2Granted
Substrate with deposition and/or friction reduction coating
AssigneeXefco Pty Ltd
InventorsThomas Hussey, Scott Whitby
Life of this patent
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Abstract
A substrate includes a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The low emissivity layer may be a metal layer which functions as a radiant barrier. The fibers include a melted exterior due to bonding of the fibres at the bonding locations melting the exterior of the fibres.
Claims20
A substrate with an array disposed thereon;
- the substrate comprises a bonding array comprising a plurality of bonding locations with fibers;
- a low emissivity layer is deposited on at least one side of the substrate;
- and the fibers include a melted exterior due to bonding of the fibres at the bonding locations melting the exterior of the fibres.
A substrate with a bonding array pattern, the substrate comprising:
- a first layer of fabric web;
- a second layer of fabric web bonded to the first layer of fabric web;
- the first and second layers of fabric web being bonded together at a plurality of bonding locations;
- a low emissivity material is disposed on at least one side of the substrate, in which the bonding locations provide a region of compressed fibres which has a larger surface area relative to the unbonded locations of the substrate;
- and
- wherein the fibers include a melted exterior due to bonding of the fibres at the bonding locations.
3 more elements
Dependencies are inferred from the claim text.