Device for production of thin plate-like laminate having film-like resin layer

A device for a production of a thin plate laminate having a film resin layer, the device being for interposing a workpiece in which a film resin composition is laminated on at least one surface of a thin plate substrate with molds to obtain the plate laminate in which the film resin layer is integrally formed on the substrate, the device comprising:

• a setting device for creating a mold retention structure in which the molds are arranged on both surface sides of the workpiece, wherein the mold retention structure is slidably arranged on a rail body, and the rail body extends in a conveyance direction of the mold retention structure such that the mold retention structure is conveyed in the conveyance direction,
• a heating device for heating the molds to a thermal deformation temperature of the film resin composition,
• a compression roller device that has two compression rollers, in which the mold retention structure, after heating of the molds, is introduced between the two compression rollers by moving along the rail body and which compresses outer surfaces of the molds by rotating the compression rollers to integrally thermocompression-bond the film resin composition and the substrate to form the thin plate laminate having the film resin layer, and
• an extraction device for extracting the molds from the mold retention structure after compression, wherein
• the setting device, the heating device, the compression roller device, and the extraction device are arranged along the rail body such that the mold retention structure is conveyed in the conveyance direction,
• each of the two compression rollers has a rolling axis around which the compression roller rotates, and the rolling axes are arranged parallel to one another, and each of the two rolling axes is arranged perpendicular to the conveyance direction,
• the compression roller device is provided with
• a drive control device that is configured to drive each of the two compression rollers synchronously wherein the two compression rollers reciprocate the mold retention structure back and forth in the conveyance direction between two edges of the workpiece, which is interposed inside the molds, while the mold retention structure is compressed in the compression roller device, and
• a pressurization part lifting means that is connected to at least one of the two compression rollers, which is referred to as a connected roller, to raise and lower the connected roller such that the connected roller moves between a pressure position for pressuring the mold retention structure and a releasing position for not contacting the mold retention structure,
• when the mold retention structure is introduced into the compression roller device, the connected roller is configured to be at the releasing position, and then to be lowered to contact the mold retention structure such that the mold retention structure is sandwiched between the connected roller and a fixed roller, which is the other of the two compression rollers not being connected to the pressurization part lifting means.