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US 12,426,397 B2Granted
System and methods for managing heat in a photonic integrated circuit
OwnerJohn Heanueinventor
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Abstract
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
Claims9
An optical transceiver comprising:
- a housing comprising an interior surface and exterior surface;
- a plurality of pins extending outward from the exterior surface of the housing;
- an interior volume at least partially enclosed within and defined by the housing;
- a plurality of connectors disposed along the interior surface of the housing, the plurality of connectors electrically connected to the plurality of pins;
- and
- a photonic integrated circuit (PIC) assembly comprising a PIC, the PIC comprising a plurality of bond pads, the PIC assembly disposed in the interior volume,
- wherein the bond pads are disposed inward from an edge of the PIC a first distance, wherein the first distance is greater than about 0.4 mm,
- wherein each of the bond pads is uniquely electrically connected to an associated connector of the plurality of connectors along the interior surface of the housing with a bond wire at least partially rounded across a distance between each of the bond pads and each associated connector, wherein a length of the bond wire is greater than a distance between each of the bond pads and the associated connector, wherein the length of the bond wire ranges from about 0.4 mm to about 2 mm.
5 more elements
Dependencies are inferred from the claim text.