Semiconductor device and method of manufacturing semiconductor device
AssigneeToyota Jidosha Kabushiki Kaisha
InventorsKatsunori Danno, Tetsuya Shoji
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AssigneeToyota Jidosha Kabushiki Kaisha
InventorsKatsunori Danno, Tetsuya Shoji
Estimating the term…
The present disclosure relates to a semiconductor device including an n-type gallium oxide semiconductor layer that has a center region and a peripheral region having a lower donor density than the center region, an electrode layer that is laminated on the n-type gallium oxide semiconductor layer, and forms Schottky junction with the n-type gallium oxide semiconductor layer in the center region as viewed from a lamination direction, and a first p-type nickel oxide semiconductor layer that is laminated on the n-type gallium oxide semiconductor layer such that the first p-type nickel oxide semiconductor layer is partially positioned between the n-type gallium oxide semiconductor layer and the electrode layer, and has an outer peripheral end portion on a peripheral region side in the peripheral region as viewed from the lamination direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.