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US 12,424,716 B2Granted
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Georgios C. Dogiamis, Telesphor Kamgaing
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Abstract
Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.
Claims25
A package substrate, comprising:
- a core with a first surface and a second surface, the core having a thickness between the first surface and the second surface;
- and
- a filter embedded in the core, wherein the filter comprises:
- a ground plane, wherein the ground plane extends from the first surface to the second surface through the thickness of the core;
- and
- a resonator laterally spaced apart from the ground plane, wherein the resonator extends from the first surface to the second surface through the thickness of the core.
3 more elements
A package substrate, comprising:
- a core with a first surface and a second surface;
- and
- a filter embedded in the core, wherein the filter comprises:
- an outer shell;
- interior walls within the outer shell, wherein the interior walls define a plurality of cavities that are coupled to each other by openings through the interior walls;
- a lid over the first surface of the core above the outer shell;
- and
- a floor over the second surface of the core and below the outer shell.
5 more elements
An electronic system, comprising:
- a board;
- a package substrate coupled to the board, wherein the package substrate comprises:
- a core with a first surface and a second surface, the core having a thickness between the first surface and the second surface;
- and
- a filter embedded in the core, wherein the filter comprises a ground plane, wherein the ground plane extends from the first surface to the second surface through the thickness of the core, and a resonator laterally spaced apart from the ground plane, wherein the resonator extends from the first surface to the second surface through the thickness of the core;
- and
- a die coupled to the package substrate.
4 more elements
Dependencies are inferred from the claim text.