Component embedded in component carrier and having an exposed side wall
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsBettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
Life of this patent
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Abstract
A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.
Claims19
A component carrier, comprising:
- a stack comprising a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
- an optical component embedded in the stack;
- wherein at least a portion of a side wall of the optical component is exposed;
- an access recess formed in the stack, wherein the access recess extends from a lateral side wall of the stack to the side wall of the optical component and the access recess exposes the side wall of the optical component;
- and
- wherein the access recess is a slit-shaped recess exposing a first side wall of the optical component and a second side wall of a further component, wherein the first side wall and the second side wall oppose each other, the optical component and the further component are arranged opposite to each other, and the optical component and the further component are communicatively coupled.
A method of manufacturing a component carrier, the method comprising:
- forming a stack of a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
- embedding an optical component in the stack;
- and
- subsequently removing material of the stack to thereby expose at least a portion of a side wall of the optical component with regard to an environment of the component carrier, wherein removing material of the stack comprises forming an access recess in the stack, the access recess extending from a lateral side wall of the stack to the side wall of the optical component, the access recess exposing the side wall of the optical component with regard to the environment of the component carrier.
A component carrier, comprising:
- a stack comprising a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
- an optical component embedded in the stack;
- wherein at least a portion of a side wall of the optical component is exposed;
- an access recess formed in the stack, wherein the access recess extends from a lateral side wall of the stack to the side wall of the optical component and the access recess exposes the side wall of the optical component;
- and
- a further component being inserted in the access recess,
- wherein the further component is configured as an optical fiber.
Dependencies are inferred from the claim text.