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US 12,424,502 B2Granted
Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles
AssigneeMicrochip Technology Incorporated
InventorsBomy Chen, Justin Sato
Life of this patent
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Abstract
An electronic device includes an integrated circuit package including a die mounted on a die carrier, a mold structure at least partially encapsulating the mounted die, and a heat transfer chimney formed on the die. The heat transfer chimney extends at least partially through the mold structure to transfer heat away from the die. The heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles.
Claims23
An electronic device, comprising:
- an integrated circuit package comprising:
- a die mounted on a die carrier;
- a mold structure at least partially encapsulating the mounted die;
- and
- a heat transfer chimney formed on the die and extending at least partially through the mold structure to transfer heat away from the die;
- wherein the heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles dispersed in an epoxy or other polymer base.
3 more elements
An electronic device, comprising:
- an integrated circuit package comprising:
- a die mounted on a die carrier;
- a mold structure at least partially encapsulating the mounted die;
- and
- a heat transfer chimney formed on the die and extending at least partially through the mold structure to transfer heat away from the die;
- wherein the heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles;
- and
- wherein the mold structure includes shielding nanoparticles to protect the die, the shielding nanoparticles including at least one of (a) magnetic shielding nanoparticles to shield the die from magnetic fields or radiation shielding nanoparticles to shield the die from ionic radiation.
5 more elements
A method, comprising:
- forming an integrated circuit package, including:
- mounting a die on a die carrier;
- forming a thermally conductive compound, including mixing thermally conductive nanoparticles with an epoxy or other polymer base;
- forming a heat transfer chimney on the die from the thermally conductive compound;
- and
- forming a mold structure at least partially encapsulating the die;
- wherein the heat transfer chimney extends at least partially through the mold structure;
- and
- wherein the heat transfer chimney includes thermally conductive nanoparticles to transfer heat away from the die.
6 more elements
A method, comprising:
- forming an integrated circuit package, including:
- mounting a die on a die carrier;
- forming a heat transfer chimney on the die;
- mixing shielding nanoparticles with a mold compound to form a nanoparticle-enhanced mold compound;
- and
- forming a mold structure at least partially encapsulating the die from the nanoparticle-enhanced mold compound
- wherein the heat transfer chimney extends at least partially through the mold structure;
- and
- wherein the heat transfer chimney includes thermally conductive nanoparticles to transfer heat away from the die.
6 more elements
Dependencies are inferred from the claim text.