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US 12,422,635 B2Granted
Thermo-electric cooler for dissipating heat of optical engine
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsing-Kuo Hsia, Chih-Kuang Yu, Chen-Hua Yu, Jui Lin Chao
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Abstract
A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.
Claims20
A method comprising:
- bonding a photonic engine onto an interposer;
- forming a first through-via over the interposer;
- bonding a package component onto the interposer, wherein the package component comprises a device die;
- encapsulating the package component, the first through-via, and the photonic engine in an encapsulant;
- attaching a thermal-electronic cooler to the photonic engine, wherein the thermal-electronic cooler is electrically connected to the first through-via;
- and
- attaching a metal lid to the package component.
4 more elements
A package comprising:
- a photonic engine;
- a package component comprising a device die;
- an encapsulant encapsulating the package component and the photonic engine therein;
- a thermal-electronic cooler attached to the photonic engine, wherein the thermal-electronic cooler comprises a current input node and a current output node, and wherein the thermal-electronic cooler comprises a cold side and a hot side, with the cold side being between the hot side and the photonic engine;
- a thermal interface material;
- and
- a metal lid attached to the package component through the thermal interface material.
4 more elements
A package comprising:
- a package substrate;
- an interposer over and bonded to the package substrate;
- a first package component over and bonded to the interposer, the first package component comprising:
- a photonic die;
- and
- a supporting substrate over the photonic die, wherein the supporting substrate comprises a micro lens therein;
- an optical fiber configured to signally couple to the photonic die;
- a thermal-electronic cooler attached to the first package component, wherein the thermal-electronic cooler is configured to dissipate heat in the first package component;
- a second package component over and bonded to the interposer;
- and
- a metal lid attached to the second package component, wherein the metal lid is configured to dissipate heat in the second package component.
8 more elements
Dependencies are inferred from the claim text.