Sensor module
AssigneeSony Semiconductor Solutions Corporation
InventorHirofumi Owaki
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Semiconductor Solutions Corporation
InventorHirofumi Owaki
Estimating the term…
[Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components. [Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a synthetic resin material that has absorptive properties with respect to first laser light. The second member is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light. The third member is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member.
A sensor module, comprising:
Dependencies are inferred from the claim text.