Structures with boron- and gallium-doped silicon germanium layers and methods and systems for forming same
AssigneeASM IP Holding B.V.
InventorsWonjong Kim, Rami Khazaka, Michael Givens, Charles Dezelah
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AssigneeASM IP Holding B.V.
InventorsWonjong Kim, Rami Khazaka, Michael Givens, Charles Dezelah
Estimating the term…
Some examples herein provide a method of forming a doped silicon germanium layer. The method may include simultaneously exposing a substrate to (a) a silicon precursor, (b), a germanium precursor, (c) a boron precursor, and (d) a heteroleptic gallium precursor. The heteroleptic gallium precursor may include (i) at least one straight chain alkyl group in which a terminal carbon is directly bonded to gallium, and (ii) at least one tertiary alkyl group in which a tertiary carbon is directly bonded to gallium. The method may include reacting the silicon precursor, the germanium precursor, the boron precursor, and the heteroleptic gallium precursor to form a silicon germanium layer on the substrate that is doped with boron and gallium.
A method of forming a doped silicon germanium layer, the method comprising:
A system for forming a doped silicon germanium layer, the system comprising:
Dependencies are inferred from the claim text.