Polishing method, machine device manufacturing method, and machine device
AssigneeMitsubishi Corporation
InventorsRyuji Monden, Kunio Kondo
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Abstract
One aspect of the present invention provides a polishing method including polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part.
Claims8
A polishing method comprising polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part,
- wherein the solvent is mineral oil or chemically-synthesized oil, and
- wherein a concentration of the fullerenes in the polishing-agent composition is adjusted such that, while the polishing is in progress, the fullerene-aggregated particles are produced when a surface roughness of the sliding part is greater than a target value and not produced when the surface roughness of the sliding part is less than or equal to the target value.
A polishing method comprising polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part,
- wherein the solvent is mineral oil or chemically-synthesized oil, and
- wherein, after the polishing is started, the polishing is performed until the fullerene-aggregated particles are no longer produced in the polishing-agent composition.
Dependencies are inferred from the claim text.