Transfer printing stamps and methods of stamp delamination

A method of micro-transfer printing, comprising:

• providing a stamp, a source wafer comprising components disposed in an arrangement corresponding to an arrangement of the posts, and a target substrate, wherein the stamp comprises (i) a support having a support surface, and (ii) posts disposed on the support surface, each of the posts comprising a distal end extending away from the support, the post having a post surface on the distal end, wherein the post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface;
• contacting the ridges of the posts to the components;
• removing the components from the source wafer, and contacting the components to a substrate surface of the target substrate,
• wherein contacting the components to the substrate surface comprises moving the components toward and in contact with the target substrate, moving the components in a direction parallel to the substrate surface and in a direction at least partially orthogonal to the ridge direction while the components are in contact with the target substrate, and moving the stamp away from the target substrate.

A stamp for micro-transfer printing, the stamp comprising:

• a support having a support surface;
• posts disposed on the support surface, each of the posts comprising a distal end extending in a vertical direction away from the support, the post having a post surface on the distal end;
• and
• a micro-device that is an unpackaged die adhered to the ridges;
• and
• wherein the post surface is a structured surface comprising ridges spatially separated by grooves that extend in a ridge direction entirely across the post surface,
• wherein (i) the posts are operable to adhere components to the ridges and (ii) the support is operable to move the posts in a horizontal direction orthogonal to the vertical direction and in a direction at least partially orthogonal to the ridge direction.