Circuit board, method for manufacturing circuit board, and resonator device
AssigneeSeiko Epson Corporation
InventorKoji Kitahara
Life of this patent
Estimating the term…
Abstract
A circuit board includes a semiconductor substrate having a first surface and a second surface located on an opposite side from the first surface, a through hole penetrating the first surface and the second surface, an organic insulating film disposed on the first surface and a side surface of the through hole, and a conductor disposed on an opposite side of the organic insulating film from a side surface side of the through hole. The side surface of the through hole has a first side surface coupled to the first surface and having a width decreased from the first surface toward the second surface, and a second side surface coupled to the second surface from an end portion of the first side surface on a second surface side.
Claims10
A circuit board comprising:
- a semiconductor substrate having a first surface and a second surface located on an opposite side from the first surface;
- a through hole penetrating the first surface and the second surface;
- an organic insulating film disposed on the first surface and a side surface of the through hole;
- an inorganic insulating film provided between a side surface of the through hole and the organic insulating film;
- and
- a conductor disposed on an opposite side of the organic insulating film from the side surface side of the through hole, wherein
- the side surface of the through hole has
- a first side surface coupled to the first surface and having a width decreased from the first surface toward the second surface, and
- a second side surface coupled to the second surface from an end portion of the first side surface on a second surface side.
A method for manufacturing a circuit board, the circuit board including
- a single crystal silicon substrate having a first surface and a second surface located on an opposite side from the first surface,
- a through hole penetrating the first surface and the second surface,
- an organic insulating film disposed on the first surface and a side surface of the through hole, and
- a conductor disposed on an opposite side of the organic insulating film from a side surface side of the through hole, the method for manufacturing the circuit board comprising:
- a circuit board preparation step of preparing the circuit board including the single crystal silicon substrate;
- a groove forming step of forming, on the first surface by wet etching, a bottomed groove having a rectangular shape in a plan view and having a first side surface having a width decreased toward the second surface;
- a through hole forming step of, after the groove forming step, forming the through hole having a second side surface extending from an end portion of the first side surface on a second surface side toward the second surface and penetrating the first surface and the second surface;
- an organic insulating film forming step of, after the through hole forming step, forming the organic insulating film at the first surface and the first side surface and the second side surface of the through hole;
- and
- a conductor forming step of forming the conductor on the organic insulating film on an opposite side from the side surface side of the through hole.
A resonator device comprising:
- a circuit board comprising:
- a semiconductor substrate having a first surface and a second surface located on an opposite side from the first surface;
- a through hole penetrating the first surface and the second surface;
- an organic insulating film disposed on the first surface and a side surface of the through hole;
- and
- a conductor disposed on an opposite side of the organic insulating film from a side surface side of the through hole, wherein
- the side surface of the through hole has
- a first side surface coupled to the first surface and having a width decreased from the first surface toward the second surface, and
- a second side surface coupled to the second surface from an end portion of the first side surface on a second surface side;
- a resonator element disposed on the first surface or the second surface of the circuit board and electrically coupled to the conductor;
- and
- a lid bonded to the circuit board so as to accommodate the resonator element between the lid and the circuit board.
Dependencies are inferred from the claim text.