US 12,418,003 B2Granted

Light emitting device and light emitting module including the same

AssigneeSeoul Viosys Co., Ltd.

InventorsJinWoong Lee, KyoungWan Kim

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Abstract

A light emitting module including a mounting substrate, light emitting chips mounted on the mounting substrate, and pads, in which the light emitting chips include a first substrate, a first light emitting unit on a first surface of the first substrate, a second substrate spaced apart from the first substrate, and a second light emitting unit on a second surface of the second substrate, the first substrate includes a first side surface including a first modified surface, and the second substrate includes a second side surface facing the first side surface and including a second modified surface, the first modified surface includes first modified regions extended in a thickness direction and first ruptured regions disposed therebetween, the second modified surface includes second modified regions extended in the thickness direction and second ruptured regions disposed therebetween, and the first ruptured regions have the same width as the second ruptured regions.

Claims17

Dependent claims

A light emitting module comprising:

a mounting substrate;
a plurality of light emitters disposed on the mounting substrate and including a first light emitter and a second light emitter;
and
a plurality of pads disposed between the light emitters and the mounting substrate,
wherein the first light emitter includes a first substrate and a first light emitting layer disposed on a first surface of the first substrate,
wherein the second light emitter includes a second substrate and a second light emitting layer disposed on a second surface of the second substrate,
wherein the first substrate and the second substrate include a first side surface extending in a first direction and a second side surface extending in a second direction, the first and second directions crossing each other,
wherein the first side surface of the first substrate includes a first modified region formed in the first direction, and the second side surface of the second substrate includes a second modified region formed in the second direction,
wherein the first modified region includes a region having a width that is different from a width of the second modified region,
wherein the first modified region includes first sub modified regions and first isolation regions disposed between the first sub modified regions, and
wherein one of the first isolation regions has a first isolation distance.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/427,456Filed 30 Jan 2024 · continuation
Priority: KR 102018014487221 Nov 2018
Published: US 2024/0170461 A123 May 2024
Granted: 16 Sep 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

H10P 54/00
Cutting or separating of wafers, substrates or parts of devices
H10W 90/00
Package configurations
H10H 20/01
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]: manufacture or treatment
H10H 20/021
Manufacture or treatment: singulating, e.g. dicing

Family

PCT/KR2019/015826Parent of this continuation · filed 19 Nov 2019
US 2024/0170461 A1Pre-grant publication · published 23 May 2024
Application17/285,886Parent of this continuation
US 11,923,345 B2Parent of this continuation
US 2021/0351167 A1Published application
US 12,418,003 B2This patent

From the US filing history. Foreign family members aren’t listed.