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US 12,417,953 B2Granted
Connector
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsJustin Catania, Michel Garnier, Fabien Quercia
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).
Claims20
An electronic device comprising:
- a wafer including a first surface having at least one first contact;
- and
- at least one die including a second surface having at least one second contact, and at least one lateral surface transverse to the second surface, the lateral surface of the die being bonded to the first surface of the wafer, wherein:
- the first contact being electrically coupled to the second contact by a connector, the connector including:
- a first number of first electrically-conductive pillars on the first contact of the wafer, at least one first electrically conductive pillar extends outward from the first contact and is transverse to the first surface of the wafer;
- a second number of second electrically-conductive pillars on the second contact of the die, at least one second electrically conductive pillar is transverse to the at least one first electrically conductive pillar and the second surface of the at least one die;
- and
- at least one electrically-conductive ball that couples the at least one first pillar to the at least one second pillar.
5 more elements
A device, comprising:
- a wafer having a first surface and a first contact at and along the first surface;
- a die including a second surface coupled to the first surface of the wafer by an adhesive, the die including a third surface transverse to the second surface, and the die including a connection area at the third surface, and the connection area including a second contact, wherein:
- the first contact being electrically coupled to the second contact by a connector, the connector including:
- a pair of electrically-conductive pillars, the pair of electrically conductive pillars including:
- a first electrically-conductive pillar stacked on and coupled to the first contact, the first electrically conductive pillar extending in a first direction transverse to the first surface;
- and
- a second electrically-conductive pillar stacked on and coupled to the first conductive pillar, the second electrically conductive pillar extending in the first direction;
- a third electrically-conductive pillar stacked on and coupled to the second contact, the third electrically-conductive pillar extending in a second direction transverse to the first direction;
- and
- an electrically-conductive ball that couples the second electrically-conductive pillar to the third electrically-conductive pillar.
7 more elements
A device, comprising:
- a wafer having:
- a first surface;
- a first contact at and along the first surface;
- and
- a second contact at and along the first surface and spaced apart from the first contact;
- a die including a second surface coupled to the first surface of the wafer by an adhesive, the die including a third surface transverse to the second surface, and the die including a connection area at the third surface, and the connection area including a third contact and a fourth contact spaced apart from the third contact;
- a first connector coupling the third contact to the first contact, the first connector including:
- one or more first electrically conductive pillars stacked on the third contact, the one or more first electrically conductive pillars are parallel with the first surface and perpendicular with the second surface;
- one or more second electrically conductive pillars stacked on the first contact, the one or more second electrically conductive pillars are parallel with the second surface and perpendicular with the first surface;
- and
- a first electrically conductive ball couples the one or more first electrically conductive pillars to the one or more second electrically conductive pillars;
- a second connector coupling the fourth contact to the second contact, the second connector including:
- one or more third electrically conductive pillars stacked on the fourth contact, the one or more third electrically conductive pillars are parallel with the first surface and perpendicular with the second surface;
- one or more fourth electrically conductive pillars stacked on the second contact, the one or more fourth electrically conductive pillars are parallel with the second surface and perpendicular with the first surface;
- and
- a second electrically conductive ball couples the one or more third electrically conductive pillars to the one or more fourth electrically conductive pillars.
13 more elements
Dependencies are inferred from the claim text.