Information processing apparatus, information analysis system, and measurement method

A chip that is a second chip in an information processing apparatus including a first chip and the second chip, wherein

• the second chip includes
• a transmission control portion configured to generate a transmission signal,
• a transmitting coil that is connected to the transmission control portion and configured to transmit the transmission signal,
• a receiving coil configured to receive the transmission signal from the first chip, and
• a detection portion configured to detect a voltage or current of the receiving coil, and
• the detection portion is configured to detect, when a change in voltage or current occurring in the receiving coil satisfies a predetermined condition,
• a change in relative position between the first chip and the second chip, or
• vibration applied to the first chip or the second chip, temperature change, pressure change, or electromagnetic wave, and
• the detection portion is configured to detect an increase or decrease, from a predetermined value, of an amplitude of the voltage or current generated when the receiving coil receives the transmission signal.

An information processing apparatus comprising:

• a first chip and a second chip that are adjacent to each other, wherein
• the first chip includes
• a first transmission control portion configured to generate a transmission signal and
• a first transmitting coil that is connected to the first transmission control portion and configured to transmit the transmission signal,
• the second chip includes
• a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil and
• a second detection portion configured to detect a voltage or current applied to the second receiving coil,
• the first chip and the second chip are fixed to a base material,
• the second detection portion is configured to, based on a change in voltage or current occurring in the second receiving coil, detect
• a change in relative position between the first chip and the second chip, or
• one of vibration applied to the first chip and the second chip, pressure change, temperature change, or electromagnetic wave, and
• the second detection portion is configured to detect an increase or decrease, from a predetermined value, of an amplitude of the voltage or current generated when the second receiving coil receives the transmission signal.