Plasmonic photonic structures including a layer that exhibits an electric-field-induced Pockels effect
AssigneeGlobalFoundries U.S. Inc.
InventorYusheng Bian
Life of this patent
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Abstract
Plasmonic photonic structures that include a layer that exhibits an electric-field-induced Pockels effect and methods of forming such structures. The structure comprises a waveguide core on a substrate, a first layer that has an overlapping relationship with the first waveguide core, and a second layer that has an overlapping relationship with the first waveguide core and the first layer. The first layer comprises a metal, and the second layer comprising a material that exhibits an electric-field-induced Pockels effect.
Claims16
A structure for a photonics chip, the structure comprising:
- a first substrate;
- a second substrate;
- a first waveguide core on the first substrate;
- a first layer that has an overlapping relationship with the first waveguide core, the first layer comprising a first metal;
- a second layer that has an overlapping relationship with the first waveguide core and the first layer, the second layer comprising a material that exhibits an electro-optic effect;
- a first dielectric layer on the second substrate, the second layer disposed on the first dielectric layer;
- and
- a second dielectric layer between the first layer and the second layer, the second dielectric layer adjoining the second layer along a bonding interface.
A structure for a photonics chip, the structure comprising:
- a substrate;
- a waveguide core on the substrate;
- a first layer that has an overlapping relationship with the waveguide core, the first layer comprising a metal;
- a second layer that has an overlapping relationship with the waveguide core and the first layer, the second layer comprising a material that exhibits an electro-optic effect;
- a first dielectric layer between the first layer and the second layer;
- and
- a second dielectric layer between the first dielectric layer and the second layer,
- wherein the second dielectric layer adjoins the first dielectric layer along a bonding interface.
A method of forming a structure for a photonics chip, the method comprising:
- forming a waveguide core on a first substrate;
- forming a first layer that has an overlapping relationship with the waveguide core, wherein the first layer comprises a metal;
- forming a second dielectric layer over the first layer;
- and
- forming a second layer that has an overlapping relationship with the waveguide core and the first layer, wherein the second layer comprises a material that exhibits an electro-optic effect,
- wherein the second layer is formed on a second substrate, and the second layer is bonded to the second dielectric layer along a bonding interface between the first substrate and the second substrate.
Dependencies are inferred from the claim text.