Spoof surface plasmon polariton transmission line structure, circuit board, and electronic device
AssigneeHuawei Technologies Co., Ltd.
InventorsYuan Liang, Dongyu Geng
Life of this patent
Estimating the term…
Loading patent…
AssigneeHuawei Technologies Co., Ltd.
InventorsYuan Liang, Dongyu Geng
Estimating the term…
This application provides a spoof surface plasmon polariton transmission line structure, a circuit board, and an electronic device, to reduce a size of the SSPP transmission line structure. The SSPP transmission line structure includes a first dielectric substrate, a first metal strip, and a second metal strip. The first metal strip and the second metal strip are respectively disposed on two opposite surfaces of the first dielectric substrate, the first metal strip and the second metal strip separately extend in a first direction, and a length of the first metal strip in the first direction is less than a length of the second metal strip in the first direction. In the first direction, a cross-sectional area of the first metal strip gradually decreases, and at least one side of the second metal strip has a plurality of protrusion parts spaced apart.
A spoof surface plasmon polariton transmission line structure, comprising:
A circuit board, comprising:
Dependencies are inferred from the claim text.