Flexible probe for MicroLED defect detection and manufacturing method therefor

A flexible probe for Micro light-emitting diode (MicroLED) defect detection, comprising:

• a flexible base and a flexible circuit film layer, wherein the flexible base comprises a flexible substrate and flexible protrusions located on the flexible substrate, the flexible circuit film layer is provided with a circuit for illuminating a MicroLED to be detected, the flexible circuit film layer is attached to a surface on a side of the flexible base on which the flexible protrusions are provided, at least a portion of the circuit of the flexible circuit film layer is located on the flexible protrusions, and when the flexible probe for MicroLED defect detection is placed on the MicroLED, the circuit on the flexible protrusions abuts against pins of the MicroLED to be detected and is electrically connected to the pins,
• wherein the flexible circuit film layer comprises a first encapsulation layer, a first electrode layer, an insulation layer, a second electrode layer and a second encapsulation layer;
• the first encapsulation layer, the first electrode layer, the insulation layer, the second electrode layer and the second encapsulation layer are arranged successively from a side where the flexible base is located to a direction away from the flexible base;
• the second encapsulation layer is provided with through holes exposing the second electrode layer;
• the second electrode layer, the second encapsulation layer and the insulation layer are formed with through holes exposing the first electrode layer;
• locations of the through holes correspond to locations of the flexible protrusions;
• and the circuit within the flexible circuit film layer is provided within the first electrode layer and the second electrode layer.