Slotted MEMS force sensor
AssigneeNextInput, Inc.
InventorsMehrnaz Rouhi Youssefi, Julius Minglin Tsai
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Abstract
Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
Claims17
A microelectromechanical system (“MEMS”) force sensor, comprising:
- a semiconductor substrate;
- a selective thinning region formed on the semiconductor substrate;
- at least one slot formed on the semiconductor substrate;
- electrical connectors arranged on the semiconductor substrate;
- at least one sensing element formed on the semiconductor substrate wherein:
- the at least one sensing element is arranged on the selective thinning region;
- the at least one sensing element is arranged between the at least one slot and one of the electrical connectors;
- the at least one sensing element is electrically coupled to the electrical connectors.
A microelectromechanical system (“MEMS”) force sensor, comprising:
- a semiconductor substrate;
- a selective thinning region formed on the semiconductor substrate;
- at least one slot formed on the semiconductor substrate;
- electrical connectors arranged on the semiconductor substrate;
- at least one sensing element formed on the semiconductor substrate wherein:
- the at least one sensing element is arranged on the selective thinning region;
- the at least one sensing elements is electrically coupled to the electrical connectors through electrical routing arranged on the semiconductor substrate to transform stress into electrical signal.
Dependencies are inferred from the claim text.