Modular heatsink and methods of use thereof
AssigneeGM Global Technology Operations LLC
InventorsTimothy James Howitt, Ronald Miller, Erin Farbar
Life of this patent
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AssigneeGM Global Technology Operations LLC
InventorsTimothy James Howitt, Ronald Miller, Erin Farbar
Estimating the term…
Heatsinks and methods are provided for dissipating thermal energy from a substrate in thermal contact therewith. The heatsinks include a plurality of sequentially coupled links. Each of the links includes a hub portion elongated along a central longitudinal axis thereof, a male connector on a first side of the hub portion and elongated along the central longitudinal axis, a female connector on a second side of the hub portion and elongated along the central longitudinal axis, wherein the female connector of each of the links is configured to couple with the male connector of an adjacent one of the links, a planar contact portion on a third side of the hub portion configured to receive thermal energy via conduction from the substrate, and a fin extending from a fourth side of the hub portion configured to dissipate the thermal energy to a surrounding environment via convection.
A heatsink for dissipating thermal energy from a substrate in thermal contact therewith, the heatsink comprising:
A heatsink for dissipating thermal energy from a substrate in thermal contact therewith, the heatsink comprising:
A method of dissipating thermal energy from a substrate, comprising:
Dependencies are inferred from the claim text.