Light or heat triggered frontally cured cure-on-demand adhesives kit

A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates, comprising a first monomer/oligomer component having 100 parts by weight and a UV or thermal cure catalyst component having 2 to 50 parts per hundred of the first monomer/oligomer component parts;

• wherein the first monomer/oligomer component and the UV or thermal cure catalyst component are mixed to obtain a ready-to-use prepolymer mixture and the ready-to-use prepolymer mixture is applied onto a first substrate;
• wherein the first monomer/oligomer component is an epoxy resin selected from diglycidyl derivatives of bisphenol A, diglycidyl derivatives of bisphenol F, or a combination thereof;
• wherein the UV or thermal cure catalyst component is a combination of benzopinacol derivatives and iodonium salts;
• wherein the first substrate is contacted with a second substrate by the mixture applied side and waits for a heat or actinic radiation trigger of bonding the first substrate and the second substrate together;
• wherein the heat or actinic radiation trigger starts a self-sustaining frontal polymerization of the mixture for curing the mixture as an adhesive to adhere the two substrates;
• and
• wherein the heat or actinic radiation trigger is providing a total irradiation of 50,000 to 300,000 mJ/cm2 or a heat source with a temperature of approximately 150 to 250° C.