Epoxy resin composition and cured product thereof
AssigneeSumitomo Chemical Company, Limited
InventorsKenichi Takeuchi, Hirofumi Kato
Life of this patent
Estimating the term…
Abstract
Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group] and the content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).
Claims9
An epoxy resin composition comprising:
- an epoxy resin (A);
- a curing agent (B);
- and
- an imidazole adduct-type curing accelerator (C),
- wherein the curing agent (B) contains a compound (B-1) represented by the following formula (B-1):
- [in the formula, R1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by the following formula (B-2):
- [in the formula, R2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group,] and
- a content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).
Dependencies are inferred from the claim text.