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US 12,415,305 B2Granted
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
AssigneeNXP USA, Inc.
InventorsSheila F. Chopin, Nishant Lakhera, Boon Yew Low
Life of this patent
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Abstract
An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.
Claims14
A method of processing encapsulant compound, the method comprising:
- processing encapsulant compound with a mechanical operator;
- and
- capturing, by a first insert disposed on a surface of the mechanical operator, foreign material in the encapsulant compound, wherein the first insert is configured to capture the foreign material in the encapsulant compound as the surface of the mechanical operator rotates.
A method of processing encapsulant compound, the method comprising:
- processing encapsulant compound with a mechanical operator characterized as a kneader, the kneader including a kneader cam on a rotator shaft, the kneader cam including a first insert disposed on a kneading surface of the kneader cam;
- and
- wherein the first insert operates to capture foreign material from the encapsulant compound.
Dependencies are inferred from the claim text.