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US 12,415,081 B2Granted
Midfield transmitter systems
AssigneeNeuspera Medical Inc.
InventorsAlexander Yeh, Timothy A. Fayram
Life of this patent
Estimating the term…
Abstract
Generally discussed herein are systems, devices, and methods for providing a therapy (e.g., stimulation) and/or data signal using an implantable device. Systems, devices and methods for interacting with (e.g., communicating with, receiving power from) an external device are also provided.
Claims20
An implantable system comprising:
- a hermetic enclosure;
- and
- a circuit assembly inside the hermetic enclosure, the circuit assembly comprising a proximal portion, a central portion, and a distal portion, wherein a first dielectric material layer comprises a portion of the proximal portion, the central portion, and the distal portion of the circuit assembly;
- wherein the proximal portion comprises a first flexible region and one or more plated conductors;
- wherein the distal portion comprises a second flexible region;
- and
- wherein the central portion comprises one or more other dielectric material layers and one or more conductive material layers.
4 more elements
A circuit assembly for an implantable device, the circuit assembly comprising:
- a proximal portion comprising a first flexible region and one or more first plated conductors;
- a distal portion comprising a second flexible region and one or more second plated conductors;
- a rigid central portion comprising one or more other dielectric material layers and one or more conductive material layers;
- and
- a first dielectric material layer comprising the proximal portion, the distal portion, and the rigid central portion of the circuit assembly.
2 more elements
A circuit assembly for an implantable device, the circuit assembly comprising:
- a proximal portion comprising a first flexible region and one or more first plated conductors;
- a distal portion comprising a second flexible region and one or more second plated conductors;
- a rigid central portion comprising one or more other dielectric material layers;
- a first dielectric material layer comprising the proximal portion, the distal portion, and the rigid central portion of the circuit assembly;
- and
- a first conductive material layer disposed on the first dielectric material layer and comprising the proximal portion, the distal portion, and the rigid central portion of the circuit assembly.
3 more elements
Dependencies are inferred from the claim text.