Immersive cooling unit for cooling electronic components and method of using the same

An immersive cooling system for cooling electronic components, comprising:

• an immersive cooling unit, for cooling electronic components, comprising;
• at least one closed heating channel, defined by at least one circumferential heating channel wall having a start and an end, accommodating one or more printed circuit boards, wherein one or more heat dissipating electronic components are provided on each printed circuit board,
• at least one closed cooling channel, defined by at least one circumferential cooling channel wall, wherein a start of the cooling channel is connected to an end of the heating channel, and wherein an end of the cooling channel is connected to the start of the heating channel such that a closed circuit is formed between the channels,
• wherein the at least one heating and cooling channel are configured for holding an immersive liquid coolant, for cooling the electronic components, said coolant at least filling the channels and submerging the one or more printed circuit boards, wherein the channels each allow a coolant flow having at least a vertical component
• wherein
• an active heat exchanger is positioned in the cooling channel, said heat exchanger provided with an internal circuit for liquid cooling, and fluid circuitry for circulating such cooling liquid with the exterior side of said cooling channel wall or immersive cooling unit, and
• a holder, said holder comprising:
• at least one holding space formed by at least a holding bottom and at least one circumferential holding wall, wherein the at least one holding wall is dimensioned to receive the cooling unit, wherein the immersive cooling unit is inserted in the at least one holding space,
• fluid circuitry,
• wherein an exterior side of the immersive cooling unit and the holder are each provided with co-acting fluid connections, such that the fluid circuitry of the immersive cooling unit and the fluid circuitry of the holder are fluidly connected,
• a least one heat extracting unit, for actively extracting heat from cooling liquid of the fluid circuitry of the active heat exchanger.