Electrical device and method for cooling electrical device
AssigneeEpec Oy
InventorsMika Suonmaa, Ilkka Heikkilä
Life of this patent
Estimating the term…
Abstract
In the solution put forth, an electrical device (1) comprises a hermetically sealed enclosure (2), at least one fuse (4) and other electrical components inside the enclosure (2), as well as a heatsink (5) outside the hermetically sealed enclosure (2). The at least one fuse (4) is connected to the heatsink (5) with heat conducting material (8). The heatsink (5) is adapted to conduct heat from the fuse to outside of the enclosure (2). The heatsink (5) features a channel (6) for a cooling medium for transferring heat from the heatsink (5) by making use of the cooling medium, whereby the heatsink (5) is a medium-cooled heatsink (5).
Claims18
An electrical device, comprising:
- a hermetically sealed enclosure,
- at least one fuse and other electrical components located inside the hermetically sealed enclosure, and
- a heatsink located outside the hermetically sealed enclosure,
- wherein the at least one fuse is connected to a wall of the heatsink or a cooling piece connected to the wall of the heatsink, by heat conducting material,
- wherein the heat conducting material is provided between a casing of the at least one fuse and the wall of the heatsink or between the casing of the at least one fuse and the cooling piece, the heatsink being configured to conduct heat from the at least one fuse to outside of the hermetically sealed enclosure, and
- wherein the heatsink includes a channel configured to accommodate a cooling medium, the cooling medium being configured to facilitate heat transfer from the heatsink, the heatsink being a medium-cooled heatsink.
A method for cooling an electrical device, the method comprising:
- moving a cooling medium in a heatsink to transfer heat away from the heatsink by the cooling medium,
- wherein the electrical device comprises a hermetically sealed enclosure, at least one fuse and other electrical components being located inside the hermetically sealed enclosure,
- wherein the heatsink is located outside the hermetically sealed enclosure,
- wherein the at least one fuse is connected to a wall of the heatsink or a cooling piece connected to the wall of the heatsink, by heat conducting material,
- wherein the heat conducting material is located between a casing of the at least one fuse and the wall of the heatsink or between the casing of the at least one fuse and the cooling piece, wherein heat is conducted by the heatsink from the at least one fuse to outside of the hermetically sealed enclosure.
Dependencies are inferred from the claim text.