Control device and manufacturing method

A control device (100) comprising a casing (110), control electronics (120) located in the casing (110), and at least one electrical feedthrough (130), wherein, by the electrical feedthrough (130), a current is provided for a load (200) which is located outside the casing (110) of the control device (100), wherein the electrical feedthrough (130) is located on the casing (110), wherein the casing (110) is fluid-tight at least in part, wherein the electrical feedthrough (130) is located in a fluid-tight region (111) of the casing (110), wherein the electrical feedthrough (130) has a metal core (131) and an insulator (133) surrounding the metal core (131), wherein the metal core (131) has an end face (132), wherein a first bond (140) is provided between the end face (132) of the metal core (131) and the control electronics (120), wherein the first bond (140) is laser-bonded at the end face (132), wherein the control electronics (120) is located on a printed circuit board (121) and the first bond (140) is located on the printed circuit board (121), wherein a buffer plate (122) is located on the printed circuit board (121) and the first bond (140) is laser-bonded at the buffer plate (122), wherein the printed circuit board (121) has a thermally conductive structure (123) in a region of the first bond (140), wherein the thermally conductive structure (123) is thermally conductively connected to the casing (110), wherein the thermally conductive structure (123) is electrically insulated against the casing (110).